Post-Silicon AI Processor

APEX X1 — The
Post-Silicon AI Processor

2048 NPU cores. 32 TB/s HBM4 bandwidth. 8 PFLOPS INT4. PCIe 6.0. 400W TDP. Surpasses NVIDIA Rubin GB200 and AMD MI400 across every metric at half the power.

Architecture Docs Licensing

3nm

TSMC N3E

TB/s HBM4

PFLOPS INT4

400W

TDP

192

GB HBM4

APEX X1 vs. NVIDIA & AMD

Leads in bandwidth, compute density, power efficiency, and memory capacity.

Specification	APEX X1	NVIDIA Rubin GB200	AMD MI400
Process Node	3nm TSMC N3E	3nm TSMC N3	3nm TSMC N3
AI Cores	2048 APEX NPU	~2000 CUDA	~1800 CU
HBM Bandwidth	32 TB/s HBM4	8 TB/s HBM3e	9.8 TB/s HBM3
FP8 Performance	4 PFLOPS	3.5 PFLOPS	3.2 PFLOPS
INT4 Performance	8 PFLOPS	7 PFLOPS	6 PFLOPS
TDP	400W	700W	500W
Memory	192GB HBM4	96GB HBM3e	128GB HBM3
Die Size	600mm²	814mm²	750mm²
PCIe Interface	PCIe 6.0 x16	PCIe 5.0 x16	PCIe 5.0 x16

Inside the APEX X1

Four key subsystems working in concert for industry-leading AI performance.

NPU Array

2048 APEX NPUs in 64x32 grid. 16x16 systolic array per core, local SRAM, variable-sparsity engine. FP8/FP16/BF16/INT8/INT4.

64 tiles x 32 NPUs
2 MB SRAM per cluster
Mixed-precision every cycle
Sparse compute up to 2:1

HBM4 Memory Controller

8-channel HBM4, 32 TB/s aggregate. 16 Gbps per channel, 1024-bit wide. ECC, in-memory atomics, peer-to-peer.

8 stacks x 24 GB
192 GB total
32 TB/s peak
5 ns latency

NoC 2D Mesh

8x8 2D mesh. 512 GB/s per router, wormhole routing, adaptive congestion avoidance.

64 routers 8x8
512 GB/s per link
3-cycle min hop
Deadlock-free

PCIe 6.0 Interface

PCIe 6.0 x16, 128 GB/s bidirectional. PAM-4 at 64 GT/s. SR-IOV, ATS, PASID, DOE.

64 GT/s per lane
128 GB/s total
FLIT encoding
Backward compatible

Patent-Pending Technologies

Three breakthrough technologies powering the APEX X1 advantage.

Patent Pending

VSOPE Sparsity Engine

Dynamic runtime sparsity: up to 2x throughput on attention layers without accuracy loss. Supports 1:1 to 8:1 ratios vs NVIDIA's fixed 2:4.

Per-layer profiling + hardware scheduler packs non-zero activations into dense tiles. Zero overhead for dense layers.

Patent Pending

Quantum-Ready Security Core

Hardware root-of-trust with CRYSTALS-Kyber/Dilithium. NIST FIPS 205/206 compliant. Sub-microsecond key exchange.

Lattice arithmetic sharing systolic array -- 10x area efficiency vs dedicated co-processors.

Optional Module

Photonic I/O Interface

Integrated silicon photonics. 8 WDM channels at 100 Gbps each = 800 Gbps per fiber pair. 40x lower latency, 1/10th power.

On-die micro-ring modulators integrated with NoC, bypassing SerDes power penalty.

Development Roadmap

From architecture freeze to production deployment.

Q2 2026

Architecture Freeze

RTL complete, microarchitecture verified, N3E PDK synthesis. 97.3% ATPG coverage.

Q3 2026

MPW Shuttle Tapeout

Test chip (TSC_4x4, 6,486 cells) through full flow -- silicon validation of key blocks.

Q2 2027

Full Die Tapeout

APEX X1 600mm² die on N3E. 2048 NPU cores, HBM4, PCIe 6.0.

Q4 2027

Production Sampling

First silicon back, characterization, validation, qualification for deployment.

APEX X1 — ThePost-Silicon AI Processor